Cloud data center expansions drive upgrades in power and cooling supply chains. BBU lithium batteries and liquid cooling are key trends, offering growth opportunities for related suppliers.
NVIDIA H20 may resume sales to China, boosting AI GPU supply and demand for HBM and GDDR. US policy shift favors Chinese adoption of high-end AI chips. New products like RTX PRO 6000 will further support diverse AI developments.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
This issue highlights server ODMs, CPUs, GPUs, and key changes in the thermal supply chain. AI servers are the focus, CSPs keep ordering, ODMs prep for new platforms, Meta and Google push in-house CPUs, with rising cooling needs. Geopolitical risks still impact the outlook.
The AI ASIC market is rapidly expanding, with TPUs shifting from internal use to external commercialization due to their energy efficiency and customization. Leading cloud and tech firms actively develop in-house ASICs to reduce costs and supply risks, driving AI hardware toward high performance, low power, and diverse applications, becoming the main accelerator after GPUs.
In 2025, global AI chips focus on high-end HBM memory; NVIDIA’s new Blackwell platform drives growth, amid geopolitical limits and steady AI server demand, with rapid HBM technology evolution toward HBM4 in 2026.